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Detail produk:
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| Nomor bagian: | 5AGZME7H3F35C4N | Jumlah LAB/CLB: | 21225 |
|---|---|---|---|
| Tipe Pemasangan: | Pemasangan Permukaan | Tegangan - Pasokan: | 0.82V ~ 0.88V |
| Suhu Operasional: | 0°C ~ 85°C (TJ) | Jumlah Elemen/Sel Logika: | 450000 |
| Menyoroti: | 450000 Logic Elements FPGA Chip,Paket FBGA-1152 Arria V GZ,Array Gerbang yang Dapat Diprogram Bidang Tegangan Inti 0.85V |
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5AGZME7 Field Programmable Gate Array Arria V GZ FPGA Chip FBGA-1152
5AGZME7 integrasi ketat dari prosesor dual-core ARM Cortex-A9 MPCore, hard IP, dan FPGA dalam satu sistem-on-a-chip (SoC) Arria V.Mendukung lebih dari 128 Gbps bandwidth puncak dengan koherensi data terintegrasi antara prosesor dan kain FPGA.
| Jumlah Elemen Logika | 450000 LE |
| Jumlah I/O | 534 I/O |
| Tegangan Supply Operating | 850 mV |
| Suhu operasi minimum | 0°C |
| Suhu operasi maksimum | + 85°C |
| Gaya pemasangan | SMD/SMT |
| Paket / Kasus | FBGA-1152 |
| Kemasan | Tray |
| Tingkat Data | 10.3125 Gb/s |
| RAM Blok Tertanam - EBR | 5306 kbit |
| Frekuensi Operasi Maksimal | 800 MHz |
| Jumlah Logic Array Blocks - LAB | 16980 LAB |
| Nomor Bagian | Paket |
|---|---|
| LM2676S-ADJ | TO-263 |
| LM2736YMKX | SOT23-6 |
| LM2743MTCX | TSSOP14 |
| LM2757TMX | DSBGA |
| LM27965SQX | LLP |
| FIN670CGFX | BGA |
| FLCS4212C | BGA |
| FLI32626H-BG | BGA |
| FLI8538-LF-AB | BGA |
| FLI8541H-LF-BE | QFP208 |
| LM293ADT | SOP8 |
| LM2940T-5.0 | TO-220 |
| LM3310SQ | LLP24 |
| LM339EDT | SOP |
| LM3489MM | MSOP8 |
| FQP6N40CF | TO-220 |
| FQPF5N50C | TO-220 |
| FS800R07A2E3_A4 | Modul |
| FSA4159L6X | QFN |
| FSB32560 | SPM27 |
| LMH6683MAX | SOP |
| LMK04031BISQE | LLP |
| LMK04033BISQE | LLP |
| LMK04828BISQE | QFN |
| LMV321M7X | SC70 |
| FSEZ1317MY | SOP7 |
| FSFR1700XCL | ZIP-9 |
| FSQ0265RLX | SOP8 |
| FT690V | QFN |
| FW82439TX | BGA |
Kontak Person: Sales Manager
Tel: 86-13410018555
Faks: 86-0755-83957753