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Detail produk:
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| Nomor Bagian: | CLE-110-01-G-DV-AK-TR | Jumlah posisi: | 20 Posisi |
|---|---|---|---|
| Lapangan - Kawin: | 0,8 mm (0,031 in) | Jumlah baris: | 2 Baris |
| Peringkat saat ini (amp): | 2,7A per Kontak | Kontak Finish Ketebalan - Kawin: | 10,0µin (0,25µm) |
| Menyoroti: | 20 Position Socket Strip,0.80mm Pitch Connectors,Tiger Beam Board to Board Connector |
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| Specification | Details |
|---|---|
| Series | CLE |
| Connector Type | Receptacle, Pass Through |
| Contact Type | Female Socket |
| Style | Board to Board |
| Number of Positions | 20 |
| Number of Positions Loaded | All |
| Pitch - Mating | 0.031" (0.80mm) |
| Number of Rows | 2 |
| Row Spacing - Mating | 0.047" (1.20mm) |
| Mounting Type | Surface Mount |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Insulation Color | Black |
| Insulation Height | 0.130" (3.30mm) |
| Operating Temperature | -55°C ~ 125°C |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish - Post | Gold |
| Features | Board Guide, Pick and Place |
| Current Rating (Amps) | 2.7A per Contact |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Contact Shape | Square |
| Contact Material | Beryllium Copper |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) |
| Part Number | Package |
|---|---|
| DSPIC33CK128MP505-E/PT | 48-TQFP |
| DSPIC33EP256MU806-E/PT | 64-TQFP |
| DSPIC33EV128GM006-I/PT | 64-TQFP |
| DSPIC33CK64MP205T-I/PT | 48-TQFP |
| DSPIC33CK64MP202-I/SS | 28-SSOP |
| DSPIC33CK64MP206-E/PT | 64-TQFP |
| DSPIC33EV32GM106-E/PT | 64-TQFP |
| DSPIC33EV256GM104T-I/PT | 44-TQFP |
| DSPIC33CK128MP506-E/PT | 64-TQFP |
| DSPIC33EP128MC202T-I/MM | 28-QFN |
Kontak Person: Sales Manager
Tel: 86-13410018555
Faks: 86-0755-83957753